(cmf04) note 2: this rating specifies the non-repetitive peak cu (cmf03) 102c 127c (cmf02) 108c 100c (note 1) (note 1) - 40 to + 125 16 maximum thermal resistance (junction to lead) th (j-l) v 10(50hz) (non-repetitive maximum peak one cycle surge forward current 2.0 1.0 0.5 0.5 a 600 600 900 800 v symbol cmf01 cmf02 cmf03 cmf04 unit suitable for compact assembly due to small surface-mount 600v-900v 0.5a-2.0a cmf01 thru cmf04 web site: www.taychipst.com 1 of 2 features e-mail: sales@taychipst.com maximum ratings and electrical characteristics . maximum repetitive peak reverse voltage v rrm maximum average forward current ta = 65 c i f maximum forward voltage at i f f r c/w junction temperature range t j c storage temperature range t stg - 40 to + 150 c rating i fsm a switching mode power supply applications ? repetitive peak reverse voltage: v rrm ? average forward current: i f (av) ? forward voltage: v fm = 2.0 v (max) ? very fast reverse-recovery time: t rr = 100 ns (max.) ? ?m ? flat tm ? (toshiba package name) package SOD-123 30(50hz) v 2.0 2.5 note 1: t ? = rectangular waveform ( = 180) (note 1) (note 1) ? = t (cmf01) ? = t ? = t rrent in one cycle of a 50 hz sine wave, condition angle 180 . therefore the rating applies only to abnormal operation, which seldom occurs during the lifespan of a device.
ratings and characteristic curves cmf01 thru cmf04 e-mail: sales@taychipst.com web site: www.taychipst.com 2 of 2 600v-900v 0.5a-2.0a cmf01 thru cmf04 switching mode power supply applications 1 100 1000 0.001 1000 1 0.01 0.1 10 100 10 0 4 12 10 8 1 100 10 3 5 30 50 6 2 0 0 40 160 0.4 0.6 1.2 20 60 120 100 0.2 0.8 80 140 = 60 120 180 1.0 160 0 0 40 0.4 1.2 20 60 120 100 0.2 0.6 80 140 = 60 120 180 0.8 1.0 0 1.0 2.0 0 0.2 0.8 1.2 0.6 = 60 120 180 3.0 0.4 1.0 0 1.0 0.01 0.1 1 10 2.0 3.0 4.0 5.0 25c 75c t j = 150c average forward current i f (av) (a) ta m a x ? i f (av) device mounted on a glass-epoxy board ( board size: 50 mm 50 mm, land size: 6 mm 6 mm ) maximum allowable ambient temperature ta m a x ( c ) average forward current i f (av) (a) p f (av) ? i f (av) average forward power dissipation p f (av) (w) instantaneous forward voltage v f (v) i f ? v f instantaneous forward current i f (a) pulse test ta = 25c f = 50 hz time t (s) r th (j-a) ? t transient thermal impedance r th (j-a) (c/w) peak surge forward current i fsm (a) number of cycles surge forward current (non-repetitive) average forward current i f (av) (a) t ? max ? i f (av) maximum allowable lead temperature t ? max (c) device mounted on a glass-epoxy board (board size: 50 mm 50 mm, land size: 2.1 mm 1.4 mm, board thickness: 1.6 t) device mounted on a ceramic board (board size: 50 mm 50 mm, land size: 2 mm 2 mm, board thickness: 0.64 t) device mounted on a glass-epoxy board (board size: 50 mm 50 mm, land size: 6 mm 6 mm, board thickness: 1.6 t) 360 0 rectangular waveform conduction angle rectangular waveform 0 360 conduction angle: rectangular waveform 0 360 conduction angle:
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